Parallel SLC NAND
Applications
Parallel SLC NAND
Package：TSOP 48L / BGA 63
Working Temperature：-40°C/-20°C ~85°C
Density：1Gbit / 2Gbit / 4Gbit / 8Gbit
Size：12mm X 20mm X1mm/ 9mm X 11mm X 1mm
Product Details
Features:
Adopt a rigorous packaging,testing and certification process.
Provide customers with high quality and full capacity solutions.
Specifications
